The 3rd ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications Rio All-Suite Hotel & Casino, Las Vegas, Nevada, USA, September 4-7, 2007

International Program Committee

(ASME/IEEE MESA07)

Hyo-Sung Ahn	ETRI, Korea
Sunil Kumar Agrawal	University of Delaware, USA
Behnam Arad	California State Univ., Sacramento, USA
Raymond de Callafon	University of California, San Diego, USA
Bo Chen	University of California at Davis, USA
YangQuan Chen	Utah State University, USA
Harry H. Cheng	University of California at Davis, USA
Jian S Dai	University of London, UK
Gregory S. Chirikjian	Johns Hopkins University, USA
Zuomin Dong	University of Victoria, Canada
Brandon Eames	Utah State University, USA
Michael T. Frye	Univ. of Texas at San Antonio, USA
Rajit Gadh	University of California at Los Angels, USA
Yanqing Gao	University of Arizona, USA
Q. Jeffrey Ge	State University of New York, USA
Clement M. Gosselin	Universite Laval, Canada
Dongbing Gu	The University of Essex, UK
Yi Guo	Stevens Institute of Technology
Martin Horauer	Univ. of Applied Sciences Technikum Vienna, Austria
Islam I. Hussein	Worcester Polytech. Institute
Zhiming Ji	New Jersey Institute of Technology, USA
Vana Kalogeraki	University of California at Irvine, USA
Hami Kazerooni	University of California at Berkeley, USA
Wilfried Kubinger	ARC Seibersdorf Research GmbH, Austria
Venkat Krovi	State University of New York at Buffalo, USA
Patrick Lanusse	ENSEIRB, France
Tony Larsson	Halmstad University, Sweden
C. S. George Lee	National Science Foundation, USA
Liwei Lin	University of California at Berkeley, USA
Honghai Liu	Univ. of Portsmouth, UK
Lili Ma	Virginia Tech., USA
J. Tenreiro Machado	ISEP, Portugal
Dinos Mavroidis	Northeastern University, USA
Concha Monje	Universidad Carlos III de Madrid, Spain
James L Overholt	US Army RDECOM-TARDEC, USA
Ivo Petras	Technical University of Kosice, Slovakia
Igor Podlubny	Technical University of Kosice, Slovakia
Michael J Pont	University Of Leicester, UK
Frederick M. Proctor	National Institute of Standards and Technology, USA
Hairong Qi	University of Tennessee, USA
Anurag Purwar	State Univ. of New York at Stony Brook, USA
Chunjiang Qian	Univ. of Texas at San Antonio, USA
Wei Ren	Utah State University, USA
Jocelyn Sabatier	Université Bordeaux I, France
Rastko R. Selmic	Louisiana Tech University
V. Sundararajan,	Univ. of California Riverside, USA
Xiaobo Tan	Michigan State University, USA
Kwun-Lon Ting	Tennessee Technological University, USA
Dariusz Ucinski	University of Zielona Góra, Poland
Blas Vinagre	University of Extremadura, Spain
Ljubo Vlacic	Griffith University, Australia
Holger Voos	HS Ravensburg-Weingarten, Germany
Feiyue Wang	University of Arizona, USA
Gloria J. Wiens	University of Florida, USA
S. Felix Wu	University of California, Davis, USA
Jizhong Xiao	City University of New York
Jia Xu	York University, Canada
Daniel Zeng	University of Arizona, USA
Du Zhang	California State Univ., Sacramento, USA
Tao Zhang	Seagate Technology International, USA
Anhong Zhou	Utah State University, USA
Mengchu Zhou	New Jersey Institute of Technology, USA
Hanqi Zhuang	Florida Atlantic University, USA
Primo Zingaretti	Polytechnic University of Marche, Ancona, Italy